Influence of Copper Nanoparticles on the Physical-Chemical Properties of Activated Sludge

The physical-chemical properties of activated sludge, such as flocculating ability, hydrophobicity, surface charge, settleability, dewaterability and bacteria extracellular polymer substances (EPS), play vital roles in the normal operation of wastewater treatment plants (WWTPs). The nanoparticles released from commercial products will enter WWTPs and can induce potential adverse effects on activated sludge. This paper focused on the effects of copper nanoparticles (CuNPs) on these specific physical-chemical properties of activated sludge. It was found that most of these properties were unaffected by the exposure to lower CuNPs concentration (5 ppm), but different observation were made at higher CuNPs concentrations (30 and 50 ppm). At the higher CuNPs concentrations, the sludge surface charge increased and the hydrophobicity decreased, which were attributed to more Cu2+ ions released from the CuNPs. The carbohydrate content of EPS was enhanced to defense the toxicity of CuNPs. The flocculating ability was found to be deteriorated due to the increased cell surface charge, the decreased hydrophobicity, and the damaged cell membrane. The worsened flocculating ability made the sludge flocs more dispersed, which further increased the toxicity of the CuNPs by increasing the availability of the CuNPs to the bacteria present in the sludge. Further investigation indicated that the phosphorus removal efficiency decreased at higher CuNPs concentrations, which was consistent with the deteriorated physical-chemical properties of activated sludge. It seems that the physical-chemical properties can be used as an indicator for determining CuNPs toxicity to the bacteria in activated sludge. This work is important because bacteria toxicity effects to the activated sludge caused by nanoparticles may lead to the deteriorated treatment efficiency of wastewater treatment, and it is therefore necessary to find an easy way to indicate this toxicity.